| Copper
Plating
Copper
in color and matte to a very shiny finish. Good corrosion
resistance when used as undercoat. A number of copper
processes are available, each design for a specific
purpose: Brightness: To eliminate the need for buffing
High speed: For electroforming Fine grain: To prevent
casehardening
|
| Spec. |
Thickness |
Comment |
| MIL-C-14550B |
Unless
otherwise specified: |
Please
note: This specification is provided for reference
only, as it has been superceded by AMS-2418 (See below).
|
| Class
0 |
0.001"-0.005"
|
For
heat treatment stop-off
|
| Class
1 |
0.001"
min
|
For
carburizing and decarburizing
shield, also plated through printed
circuit boards. |
| Class
2 |
0.0005"
min
|
As
an undercoat for nickel and other platings |
| Class
3 |
0.0002"
min
|
To
prevent basis metal migration
into tin (prevents poisoning solderability). |
| Class
4 |
0.0001"
min
|
| AMS-2418F
(Alternate spec. to supercede MIL-C-14550) |
Unless
otherwise specified:
0.0005"-0.0007" |
Copper
flash about 0.0001” Preproduction approval required
or must be waived in writing. |
