| Tin
Lead Plating
Either
a matte or bright luster is acceptable. Has excellent
solderability. 0.0002" copper plate generally required
on copper base alloys. No undercoating required on
steel substrates unless otherwise specified.
|
| Spec. |
Thickness |
Comment |
| AMS-P-81728A |
Unless
otherwise
specified:
.0003"-.0005" |
50%
- 70% Tin, Remainder is lead. |
| Standard
Composition 60/40 Sn-Pb |
| Optional
Composition 90/10 Sn-Pb |
Nominal
90% Tin, Remainder is lead (This composition only when
specified). |